High Quality Polyimide Material Flexible PCB Double Layer Flex PCB FPC
This is a double‑layer flexible printed circuit (FPC) manufactured using high‑quality polyimide (PI) as the base material. It features excellent flexibility, bending resistance, high temperature resistance and stable electrical performance. The double‑layer structure provides stronger wiring capability and higher integration, making it ideal for compact, dynamic and space‑limited electronic applications such as connectors, displays, wearable devices, cameras and miniaturized modules.
Product Description
High‑Grade Polyimide (PI) Substrate
Superior heat resistance, chemical resistance, insulation and mechanical stability for long‑term reliability.
Double Layer FPC Structure
Dual‑sided circuit design with through‑hole interconnection, higher wiring density and stronger functionality.
Excellent Flexibility & Bendability
Supports repeated bending, folding and torsion, ideal for 3D assembly and dynamic motion applications.
Lightweight & Ultra‑Thin
Thin, flexible and lightweight, greatly saving space and reducing overall device weight.
High Temperature Resistance
Stable performance under high‑temperature soldering and operating conditions.
High Precision & Good Signal Integrity
Fine line capability, low impedance loss, suitable for high‑resolution and high‑speed signal transmission.
Wide Application
Widely used in consumer electronics, wearables, automotive, medical, camera and display modules.
