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TLF-35 OSP Surface 0.9mm Double Layer PCB Board Microwave Circuit Board

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TLF-35 OSP Surface 0.9mm Double Layer PCB Board Microwave Circuit Board

Name: TLF35 OSP Surface 09mm Double Layer PCB Board Microwave Circuit Board
Brand: XSW PCB
Price: 1 USD

Model Number : XSWPCB

Material : TLF-35

MOQ : 1

Delivery Time : 8-15DAYS

Surface Finish : OSP

Payment Terms : Western Union

Certification : UL ,IOS9000

Board Thickness : 0.9 mm (Customizable)

Place of Origin : China

Copper Thickness : 1/1 oz

Supply Ability : 1 Million Square feet/per month

Price : Negotiable

Brand Name : XSW PCB

Layer Count : 2-Layer

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TLF-35 OSP Surface 0.9mm Double Layer PCB Board Microwave Circuit Board

This double-layer microwave PCB adopts Taconic TLF-35 organic ceramic laminate substrate, finished board thickness of 0.9mm with OSP surface treatment, specially manufactured for RF and microwave communication circuits. TLF-35 features stable dielectric constant Dk=3.5 and ultra-low dissipation factor, effectively reducing signal attenuation and passive intermodulation distortion (PIMD) under microwave frequency band. OSP organic anti-oxidation treatment provides reliable solderability with competitive cost advantage. Strict impedance control and reliable plated through-hole (PTH) connection guarantee consistent RF signal transmission performance. With low moisture absorption and outstanding dimensional stability, this PCB is widely used for microwave antennas, power amplifiers, filters, couplers, repeaters and commercial wireless communication RF modules.

Key Specifications

Layer Count	2-Layer
Material	TLF-35
Board Thickness	0.9 mm (Customizable)
Copper Thickness	1/1 oz
Minimum Hole Size	0.2 mm
Minimum Line Width	0.1 mm
Minimum Line Spacing	0.1 mm
Solder Mask Color	Black
Surface Finish	OSP

Product Description

1.Double layer PCB construction, finished thickness: 0.9mm, built on Taconic TLF-35 high frequency material
2.TLF-35 organic ceramic reinforced laminate, stable Dk=3.5 across wide frequency range
3.Low dissipation factor, minimize insertion loss and phase shift for microwave signal
4.Optimized PIMD performance, greatly reduce passive intermodulation interference
5.OSP surface finish, eco-friendly, good solderability and cost-effective
6.Superior plated through-hole (PTH) reliability, stable interlayer electrical conduction
7.Ultra-low water absorption, less performance drift under humid working environment
8.High copper peel strength, strong bonding between copper trace and dielectric substrate
9.Precise controlled impedance service available to meet microwave circuit design demands
10.Excellent dimensional stability, suitable for mass production of commercial RF microwave equipment

Design Specifications

Item	Mass Production Capability	Extreme Capability
Board Thickness Range	0.3~6.0mm	0.3~6.0mm
Exposure Alignment Accuracy	±0.015mm	±0.005mm
Minimum Annular Ring	Single side ≥0.05mm	Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper)	0.05mm / 0.05mm	0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)	0.05mm / 0.05mm	0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)	0.075mm / 0.075mm	0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1/2oz base copper)	±0.005mm	±0.005mm
Etching Tolerance (1oz base copper)	±0.0075mm	±0.0075mm
Gold Finger Total Pitch Tolerance	<30mm: ±0.05mm 30~60mm: ±0.075mm	<30mm: ±0.03mm 30~60mm: ±0.05mm

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